We know that the width of a DDR-4 module is 133 mm. Right? Well. I resized (a snippet of) the image that Apple uses on its website and here it is:
processor cooler heatsink pretty big? It measures almost 8 x 11 cm. A super size for both the LGA2066 and LGA36471 processors. Yeah. I still wonder why it is that big. Is that just to dissipate the heat, or is Apple really going to use a LGA36471 socket/processor?
Now look at that chip/print below it. What is that? The first time that I looked at the image, I immediately thought about some sort of Intel Fabric Passive (IFP). Something you see on Knights Landing Processors wherw a Wolf River Fabric is used (on supported modules).
I am probably wrong, and yes it supports six memory channels (max). Compared to four for LGA2066 processors, but none of them supports ECC memory. And there is no need to use all six channels. Four is enough, be it slightly slower.
What do you think?
Update: No. Sorry Pike. Apple is not going to use the LGA3647-1. It’s just to big to fit underneath the two heat pipes. However. The LGA2066 is 45 mm x 52.5 mm. A much better fit.
Edit: Also. I went through the firmware. Once again. And the CPUID code to read the brand string does not include checks for the X series SKU (0x55).